Sander, D., Enders, A., Kirschner, J.
A simple technique to measure stress in ultrathin films.
Review of Scientific Instruments 66, (9),pp 4734 - 4735 American Institute of Physics, (1995)
We demonstrate an easy implementation of the cantilever bending beam approach to measure stress during film growth in ultrahigh vacuum. Using a simple and compact optical deflection technique, film stress with sub-monolayer sensitivity can be detected. A stress measurement during FeSi2, formation on Si(111) is presented.
ki-1995-a01